ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding
نویسندگان
چکیده
In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in detection chip defects, which represents an important part inspection products after packaging. However, current traditional defect algorithm cannot meet demands high accuracy, fast speed, real-time industrial production. Therefore, this paper proposes a new multi-scale feature fusion module (ATSPPF) based on convolutional neural networks, can more fully extract semantic information at different scales. addition, module, we design deep learning model (ATNet) for detecting lead defects chips. The experimental results show that 8.2 giga floating point operations (GFLOPs) 146 frames per second (FPS), mAP0.5 mAP0.5–0.95 achieve average accuracy 99.4% 69.3%, respectively, while speed is faster than baseline yolov5s by nearly 50%.
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ژورنال
عنوان ژورنال: Micromachines
سال: 2023
ISSN: ['2072-666X']
DOI: https://doi.org/10.3390/mi14071375